Inventor

SRIVASTAVA RAVI PRAKASH

US19 patents

⚠️ This page may combine multiple inventors who share the name “SRIVASTAVA RAVI PRAKASH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SRIVASTAVA RAVI PRAKASH

GLOBALFOUNDRIES INC

Self-aligned multiple patterning processes using bi-layer mandrels and cuts formed with block masks

Integrated circuits including organic interlayer dielectric layers and methods for fabricating the same

Interconnects with variable space mandrel cuts formed by block patterning

Multiple patterning with lithographically-defined cuts

Methods and devices for back end of line via formation

Methods of fabricating BEOL interlayer structures

Chamferless interconnect vias of semiconductor devices

Structure and method to improve overlay performance in semiconductor devices

Structure and method to improve overlay performance in semiconductor devices

Methods and devices for metal filling processes

GLOBALFOUNDRIES US INC

Enlarged multilayer nitride waveguide for photonic integrated circuit

Waveguide cores surrounded by an airgap

Multi-substrate coupling for photonic integrated circuits

Optical phase shifter with one or more integrated thermoelectric devices

Multiple patterning with mandrel cuts defined by block masks

SRIVASTAVA RAVI PRAKASH

Methods and structures to enable self-aligned via etch for Cu damascene structure using trench first metal hard mask (TFMHM) scheme

Integrated circuit system with ultra-low k dielectric and method of manufacture thereof

Method to reduce depth delta between dense and wide features in dual damascene structures

PARK WAN-JAE

Methods of patterning insulating layers using etching techniques that compensate for etch rate variations