Inventor
PANECCASIO JR VINCENT
US28 patents
⚠️ This page may combine multiple inventors who share the name “PANECCASIO JR VINCENT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MACDERMID ENTHONE INC
11 patentsUS11035048B2Jun 15, 2021
Cobalt filling of interconnects
MACDERMID ENTHONE INC3 citations70
US10519557B2Dec 31, 2019
Leveler compositions for use in copper deposition in manufacture of microelectronics
MACDERMID ENTHONE INC2 citations70
US11697884B2Jul 11, 2023
Copper deposition in wafer level packaging of integrated circuits
MACDERMID ENTHONE INC0 citations61
USRE49202ESep 6, 2022
Copper electrodeposition in microelectronics
MACDERMID ENTHONE INC0 citations61
US11124888B2Sep 21, 2021
Copper deposition in wafer level packaging of integrated circuits
MACDERMID ENTHONE INC0 citations61
US12398480B2Aug 26, 2025
Leveler compositions for use in copper deposition in manufacture of microelectronics
MACDERMID ENTHONE INC0 citations60
US11401618B2Aug 2, 2022
Cobalt filling of interconnects
MACDERMID ENTHONE INC0 citations59
US11434578B2Sep 6, 2022
Cobalt filling of interconnects in microelectronics
MACDERMID ENTHONE INC0 citations58
US10995417B2May 4, 2021
Cobalt filling of interconnects in microelectronics
MACDERMID ENTHONE INC0 citations58
US12270121B2Apr 8, 2025
Composition and method for fabrication of nickel interconnects
MACDERMID ENTHONE INC0 citations49
US10294574B2May 21, 2019
Levelers for copper deposition in microelectronics
MACDERMID ENTHONE INC0 citations38
ENTHONE
9 patentsUS7670950B2Mar 2, 2010
Copper metallization of through silicon via
ENTHONE43 citations92
US6776893B1Aug 17, 2004
Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
ENTHONE53 citations89
US6375866B1Apr 23, 2002
Method for applying a conductive paint coating and articles made thereby
ENTHONE40 citations89
US8771495B2Jul 8, 2014
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
ENTHONE8 citations84
US7998859B2Aug 16, 2011
Surface preparation process for damascene copper deposition
ENTHONE16 citations84
US7332193B2Feb 19, 2008
Cobalt and nickel electroless plating in microelectronic devices
ENTHONE16 citations83
US7815786B2Oct 19, 2010
Copper electrodeposition in microelectronics
ENTHONE6 citations72
US9613858B2Apr 4, 2017
Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
ENTHONE0 citations52
US9493884B2Nov 15, 2016
Copper electrodeposition in microelectronics
ENTHONE0 citations51
ENTHONE OMI INC
4 patentsUS5182006AJan 26, 1993
Zincate solutions for treatment of aluminum and aluminum alloys
ENTHONE OMI INC34 citations90
US6013203AJan 11, 2000
Coatings for EMI/RFI shielding
ENTHONE OMI INC38 citations89
US5061351AOct 29, 1991
Bright tin electrodeposition composition
ENTHONE OMI INC15 citations71
US5415685AMay 16, 1995
Electroplating bath and process for white palladium
ENTHONE OMI INC10 citations66