Inventor
YAP WENG FOONG
US12 patents
⚠️ This page may combine multiple inventors who share the name “YAP WENG FOONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YAP WENG FOONG
4 patentsUS9123685B2Sep 1, 2015
Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof
YAP WENG FOONG6 citations71
US8927345B2Jan 6, 2015
Device package with rigid interconnect structure connecting die and substrate and method thereof
YAP WENG FOONG6 citations66
US9018045B2Apr 28, 2015
Microelectronic packages and methods for the fabrication thereof
YAP WENG FOONG1 citations50
US8927417B2Jan 6, 2015
Semiconductor package signal routing using conductive vias
YAP WENG FOONG1 citations49
FREESCALE SEMICONDUCTOR INC
3 patentsUS9029202B2May 12, 2015
Method of forming a high thermal conducting semiconductor device package
FREESCALE SEMICONDUCTOR INC3 citations62
US10319689B2Jun 11, 2019
Antenna assembly for wafer level packaging
FREESCALE SEMICONDUCTOR INC0 citations41
US9786515B1Oct 10, 2017
Semiconductor device package and methods of manufacture thereof
FREESCALE SEMICONDUCTOR INC0 citations40