Inventor
MCCLAIN BENJAMIN L
US19 patents
Patents
19 patentsUS10090177B1Oct 2, 2018
Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
MICRON TECHNOLOGY INC5 citations82
US10276539B1Apr 30, 2019
Method for 3D ink jet TCB interconnect control
MICRON TECHNOLOGY INC7 citations79
US10840209B2Nov 17, 2020
Methods and systems for manufacturing semiconductor devices
MICRON TECHNOLOGY INC2 citations73
US10840210B2Nov 17, 2020
Methods and systems for manufacturing semiconductor devices
MICRON TECHNOLOGY INC2 citations73
US10950568B2Mar 16, 2021
Semiconductor device assembly with surface-mount die support structures
MICRON TECHNOLOGY INC4 citations72
US10952333B2Mar 16, 2021
Method for stress reduction in semiconductor package via carrier
MICRON TECHNOLOGY INC2 citations72
US10548230B2Jan 28, 2020
Method for stress reduction in semiconductor package via carrier
MICRON TECHNOLOGY INC3 citations72
US11594432B2Feb 28, 2023
Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
MICRON TECHNOLOGY INC2 citations71
US10410891B2Sep 10, 2019
Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
MICRON TECHNOLOGY INC1 citations71
US12087720B2Sep 10, 2024
Semiconductor device assembly with surface-mount die support structures
MICRON TECHNOLOGY INC0 citations62
US12080678B2Sep 3, 2024
Methods and systems for manufacturing semiconductor devices
MICRON TECHNOLOGY INC0 citations62
US11705425B2Jul 18, 2023
Thermocompression bond tips and related apparatus and methods
MICRON TECHNOLOGY INC0 citations62
US11410962B2Aug 9, 2022
Methods and systems for manufacturing semiconductor devices
MICRON TECHNOLOGY INC1 citations62
US11410963B2Aug 9, 2022
Methods and systems for manufacturing semiconductor devices
MICRON TECHNOLOGY INC0 citations62
US11024595B2Jun 1, 2021
Thermocompression bond tips and related apparatus and methods
MICRON TECHNOLOGY INC0 citations62
US11670612B2Jun 6, 2023
Method for solder bridging elimination for bulk solder C2S interconnects
MICRON TECHNOLOGY INC1 citations61
US10998208B2May 4, 2021
Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
MICRON TECHNOLOGY INC0 citations60
US10700038B2Jun 30, 2020
Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing tool
MICRON TECHNOLOGY INC0 citations50
US10879195B2Dec 29, 2020
Method for substrate moisture NCF voiding elimination
MICRON TECHNOLOGY INC0 citations40