Inventor

SON HONGSEONG

US3 patents

⚠️ This page may combine multiple inventors who share the name “SON HONGSEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

1 patent

US6709970B1Mar 23, 2004

Method for creating a damascene interconnect using a two-step electroplating process

SAMSUNG ELECTRONICS CO LTD43 citations86

AKRION SYSTEMS LLC

1 patent

US10079164B2Sep 18, 2018

System, apparatus, and method for processing substrates using acoustic energy

AKRION SYSTEMS LLC0 citations46

NAURA AKRION INC

1 patent

US10607864B2Mar 31, 2020

System, apparatus, and method for processing substrates using acoustic energy

NAURA AKRION INC0 citations41