Inventor
WATANABE KAZUTO
JP20 patents
⚠️ This page may combine multiple inventors who share the name “WATANABE KAZUTO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SANDISK TECHNOLOGIES LLC
8 patentsUS10790296B1Sep 29, 2020
Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer
SANDISK TECHNOLOGIES LLC19 citations93
US10217746B1Feb 26, 2019
Three-dimensional memory device having L-shaped word lines and a support structure and methods of making the same
SANDISK TECHNOLOGIES LLC32 citations93
US10181442B1Jan 15, 2019
Three-dimensional memory device having L-shaped word lines and methods of making the same
SANDISK TECHNOLOGIES LLC23 citations93
US10211215B1Feb 19, 2019
Three-dimensional memory device containing word lines having vertical protrusion regions and methods of making the same
SANDISK TECHNOLOGIES LLC25 citations91
US10797035B1Oct 6, 2020
Bonded assembly containing side bonding structures and methods of manufacturing the same
SANDISK TECHNOLOGIES LLC16 citations84
US12256544B2Mar 18, 2025
Three-dimensional memory device containing etch-stop structures and self-aligned insulating spacers and method of making the same
SANDISK TECHNOLOGIES LLC1 citations61
US12519013B2Jan 6, 2026
Semiconductor device having edge seal and method of making thereof without metal hard mask arcing
SANDISK TECHNOLOGIES LLC0 citations51
US11812598B2Nov 7, 2023
Memory device including laterally perforated support pillar structures surrounding contact via structures and methods for forming the same
SANDISK TECHNOLOGIES LLC0 citations51
HITACHI LTD
3 patentsUS6537461B1Mar 25, 2003
Process for treating solid surface and substrate surface
HITACHI LTD60 citations96
US6613242B2Sep 2, 2003
Process for treating solid surface and substrate surface
HITACHI LTD12 citations82
US6664184B2Dec 16, 2003
Method for manufacturing semiconductor device having an etching treatment
HITACHI LTD3 citations62
JSR CORP
3 patentsUS11249398B2Feb 15, 2022
Method for producing plated shaped structure and photosensitive resin composition for production of plated shaped structures
JSR CORP0 citations50
US9809489B2Nov 7, 2017
Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device
JSR CORP0 citations45
US9543201B2Jan 10, 2017
Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection
JSR CORP0 citations33