Inventor

YOKOMIZO IKUE

JP3 patents

⚠️ This page may combine multiple inventors who share the name “YOKOMIZO IKUE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SANDISK TECHNOLOGIES LLC

2 patents

US10790296B1Sep 29, 2020

Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer

SANDISK TECHNOLOGIES LLC19 citations93

US10797035B1Oct 6, 2020

Bonded assembly containing side bonding structures and methods of manufacturing the same

SANDISK TECHNOLOGIES LLC16 citations84

WESTERN DIGITAL TECH INC

1 patent

US11569139B2Jan 31, 2023

Electrical overlay measurement methods and structures for wafer-to-wafer bonding

WESTERN DIGITAL TECH INC1 citations61