Inventor
MANJUNATH NISHANTH
US2 patents
Patents
2 patentsUS11286560B2Mar 29, 2022
Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching
LAM RES CORP2 citations69
US10697059B2Jun 30, 2020
Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching
LAM RES CORP3 citations69