Inventor
KIM SEOKHO
KR25 patents
⚠️ This page may combine multiple inventors who share the name “KIM SEOKHO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
18 patentsUS10923452B2Feb 16, 2021
Substrate bonding apparatus
SAMSUNG ELECTRONICS CO LTD7 citations80
US11749587B2Sep 5, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations73
US11380607B2Jul 5, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations73
US11362067B2Jun 14, 2022
Methods of manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD3 citations70
US12334477B2Jun 17, 2025
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations62
US11887966B2Jan 30, 2024
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations62
US12142588B2Nov 12, 2024
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US11824035B2Nov 21, 2023
Method of manufacturing a semiconductor device including bonding layer and adsorption layer
SAMSUNG ELECTRONICS CO LTD0 citations61
US11616036B2Mar 28, 2023
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11348892B2May 31, 2022
Semiconductor devices including bonding layer and adsorption layer
SAMSUNG ELECTRONICS CO LTD1 citations61
US11296045B2Apr 5, 2022
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US10109665B2Oct 23, 2018
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations51
US12500189B2Dec 16, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US11887841B2Jan 30, 2024
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations49
US11658139B2May 23, 2023
Semiconductor package for improving bonding reliability
SAMSUNG ELECTRONICS CO LTD0 citations49
US10411062B2Sep 10, 2019
Substrate bonding apparatus having adsorption sectors with different vacuum pressures and method of manufacturing semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations48
US11728197B2Aug 15, 2023
Wafer to wafer bonding apparatus and wafer to wafer bonding method
SAMSUNG ELECTRONICS CO LTD0 citations47
US12278251B2Apr 15, 2025
Image sensor
SAMSUNG ELECTRONICS CO LTD0 citations44