Inventor

TRASPORTO ARNEL SENOSA

SG57 patents

⚠️ This page may combine multiple inventors who share the name “TRASPORTO ARNEL SENOSA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TRASPORTO ARNEL SENOSA

DO BYUNG TAI

Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof

Integrated circuit packaging system with lead encapsulation and method of manufacture thereof

Integrated circuit packaging system with trenched leadframe and method of manufacture thereof

Integrated circuit packaging system with trace protection layer and method of manufacture thereof

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof

Integrated circuit packaging system with terminals and method of manufacture thereof

Integrated circuit packaging system with terminals and method of manufacture thereof

Leadframe system with warp control mechanism and method of manufacture thereof

Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof

Integrated circuit packaging system with thermal emission and method of manufacture thereof

Integrated circuit packaging system with contacts and method of manufacture thereof

Integrated circuit packaging system with pad and method of manufacture thereof

Integrated circuit packaging system with leadframe and method of manufacture thereof

Integrated circuit packaging system with routable traces and method of manufacture thereof

Integrated circuit packaging system with routable trace and method of manufacture thereof

Integrated circuit packaging system with electrical interface and method of manufacture thereof

Integrated circuit packaging system with planarity control and method of manufacture thereof

Integrated circuit packaging system with fiber-less substrate and method of manufacture thereof

Integrated circuit packaging system with leadframe lead array routing and method of manufacture thereof

Integrated circuit packaging system with electrical interface and method of manufacture thereof

Integrated circuit packaging system with die paddle and method of manufacture thereof

Integrated circuit packaging system with formed interconnects and method of manufacture thereof

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with leads and method of manufacture thereof

Coreless integrated circuit packaging system and method of manufacture thereof

STATS CHIPPAC LTD

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof

Semiconductor device and method of forming a package in-fan out package

Optical semiconductor device having pre-molded leadframe with window and method therefor

Mountable integrated circuit package-in-package system

Integrated circuit packaging system with circuitry stacking and method of manufacture thereof

Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps

Integrated circuit packaging system with routable circuitry and method of manufacture thereof

Integrated circuit package system with leadfinger support

Integrated circuit package system with multiple molding

CAMACHO ZIGMUND RAMIREZ

Integrated circuit package system with concave terminal

Integrated circuit packaging system with island terminals and method of manufacture thereof

Integrated circuit packaging system with leads and transposer and method of manufacture thereof

CAMACHO ZIGMUND R

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

Optical semiconductor device having pre-molded leadframe with window and method therefor

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

BATHAN HENRY DESCALZO

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

DIMACULANGAN GARRET

Integrated circuit packaging system with unplated leadframe and method of manufacture thereof

HAN BYUNG JOON

Integrated circuit mounting system with paddle interlock and method of manufacture thereof