Inventor

HSU TZU-HSUAN

TW177 patents

⚠️ This page may combine multiple inventors who share the name “HSU TZU-HSUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSU TZU-HSUAN

TAIWAN SEMICONDUCTOR MFG

Image sensor element for backside-illuminated sensor

Enhanced color image sensor device and method of making the same

Vertically integrated image sensor chips and methods for forming the same

Semiconductor device having enhanced photo sensitivity and method for manufacture thereof

Semiconductor devices and methods of manufacture thereof

Image sensor with optical guard ring and fabrication method thereof

Image sensor with optical guard ring and fabrication method thereof

Method of making wafer structure for backside illuminated color image sensor

Method and apparatus for image sensor packaging

Semiconductor devices, methods of manufacturing thereof, and image sensor devices

Semiconductor switching device separated by device isolation

Method for providing metal extension in backside illuminated sensor for wafer level testing

Method to optimize substrate thickness for image sensor device

Photodetector for backside-illuminated sensor

Guard ring structure for improving crosstalk of backside illuminated image sensor

Hollow dielectric for image sensor

Interconnect structure and method

TAIWAN SEMICONDUCTOR MFG CO LTD

Isolation structure for bond pad structure

Isolation structure for bond pad structure

Apparatus for reducing optical cross-talk in image sensors

Stacked grid design for improved optical performance and isolation

Method for reducing optical cross-talk in image sensors

Voltage biased metal shielding and deep trench isolation for backside illuminated (BSI) image sensors

Apparatus and method for reducing optical cross-talk in image sensors

Semiconductor devices, methods of manufacturing thereof, and image sensor devices

Image sensor with wide contact

Apparatus and method for reducing optical cross-talk in image sensors

3DIC interconnect devices and methods of forming same

Apparatus for reducing optical cross-talk in image sensors

Interconnect structure for stacked device and method

Interconnect structure for stacked device and method

Multi-wafer stacking by Ox-Ox bonding

MACRONIX INT CO LTD

Methods of operating non-volatile memory cells having an oxide/nitride multilayer insulating structure

Operation scheme for spectrum shift in charge trapping non-volatile memory

Circuit and method for programming charge storage memory cells

Program and erase methods with substrate transient hot carrier injections in a non-volatile memory

Methods to resolve hard-to-erase condition in charge trapping non-volatile memory

Vertical channel transistor structure and manufacturing method thereof

In-memory computation device

Program and erase methods with substrate transient hot carrier injections in a non-volatile memory

Non-volatile memory device having a nitride-oxide dielectric layer

Methods to resolve hard-to-erase condition in charge trapping non-volatile memory

Method of determining optimal voltages for operating two-side non-volatile memory and the operating methods

Memory cell

Programming method for controlling memory threshold voltage distribution

3D polysilicon ROM and method of fabrication thereof

LIN JENG-SHYAN

Apparatus and method for reducing cross talk in image sensors

LUE HANG-TING

Cell operation methods using gate-injection for floating gate NAND flash memory

HSU TZU-HSUAN

Method to optimize substrate thickness for image sensor device

SHIAU GWO-YUH

Silicon substrate with reduced surface roughness