Inventor

JEON O-SEOB

KR20 patents

⚠️ This page may combine multiple inventors who share the name “JEON O-SEOB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JEON O-SEOB

FAIRCHILD KR SEMICONDUCTOR LTD

Power module package having improved heat dissipating capability

Power module package having improved heat dissipating capability

Semiconductor package suitable for high voltage applications

Molded leadless package having a partially exposed lead frame pad

Semiconductor power package module

Power module having stacked flip-chip and method of fabricating the power module

Stacked intelligent power module package

Power module and method of fabricating the same

Three-dimensional power semiconductor module and method of manufacturing the same

Power module having stacked flip-chip and method for fabricating the power module

Power device package

Power module for low thermal resistance and method of fabricating the same

Heat sink package

Power module for low thermal resistance and method of fabricating the same

SON JOON-SEO

Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package

Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package

LIM SEUNG-WON

Power module having stacked flip-chip and method of fabricating the power module

FAIRCHILD KOREA SEMICONDUCTOR LTD

Semiconductor package

KANG IN-GOO

Semiconductor package and methods of fabricating the same

EOM JOO-YANG

Heat sink package