Inventor
KO ERIC
TW12 patents
⚠️ This page may combine multiple inventors who share the name “KO ERIC”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
10 patentsUS6667546B2Dec 23, 2003
Ball grid array semiconductor package and substrate without power ring or ground ring
SILICONWARE PRECISION INDUSTRIES CO LTD218 citations99
US6414385B1Jul 2, 2002
Quad flat non-lead package of semiconductor
SILICONWARE PRECISION INDUSTRIES CO LTD335 citations99
US6198171B1Mar 6, 2001
Thermally enhanced quad flat non-lead package of semiconductor
SILICONWARE PRECISION INDUSTRIES CO LTD357 citations99
US6282094B1Aug 28, 2001
Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD182 citations98
US6246111B1Jun 12, 2001
Universal lead frame type of quad flat non-lead package of semiconductor
SILICONWARE PRECISION INDUSTRIES CO LTD129 citations98
US6265763B1Jul 24, 2001
Multi-chip integrated circuit package structure for central pad chip
SILICONWARE PRECISION INDUSTRIES CO LTD87 citations97
US6427976B1Aug 6, 2002
Lead-frame-based chip-scale package and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD42 citations92
US6306682B1Oct 23, 2001
Method of fabricating a ball grid array integrated circuit package having an encapsulating body
SILICONWARE PRECISION INDUSTRIES CO LTD26 citations92
US6281578B1Aug 28, 2001
Multi-chip module package structure
SILICONWARE PRECISION INDUSTRIES CO LTD42 citations92
US6555296B2Apr 29, 2003
Fine pitch wafer bumping process
SILICONWARE PRECISION INDUSTRIES CO LTD44 citations90