Inventor

HUANG RUI

CN291 patents

⚠️ This page may combine multiple inventors who share the name “HUANG RUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG RUI

STATS CHIPPAC LTD

Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Integrated circuit package system for electromagnetic isolation

Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure

Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interference

Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof

Integrated circuit package-in-package system with wire-in-film encapsulant

Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device

Semiconductor package and method of reducing electromagnetic interference between devices

Semiconductor device and method of placing semiconductor die on a temporary carrier using fiducial patterns

Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant

Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure

HUANG RUI

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Bird feeder

Integrated circuit packaging system with package underfill and method of manufacture thereof

Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

INTEL CORP

Measurement reporting in D2D communication

Downlink control indication for a stand-alone new carrier type (NCT)

User equipment positioning in long-term evolution coordinated multipoint communication systems

Scheduling timing design for a TDD system

Hybrid automatic repeat request (HARQ) mapping for carrier aggregation (CA)

Hybrid automatic repeat request (HARQ) mapping for carrier aggregation (CA)

Interference notification in device-to-device communication

CHOW SENG GUAN

Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Integrated circuit packaging system with encapsulation connector and method of manufacture thereof

Integrated circuit package system with shield

Integrated circuit package system with wire-in-film encapsulation

APPLE INC

Scheduling timing design for a TDD system

Bandwidth part (BWP) switching

Techniques for NR cell/beam identification

Beamforming measurements based on PSS/SSS

DO BYUNG TAI

Integrated circuit package system for shielding electromagnetic interference

Package system for shielding semiconductor dies from electromagnetic interference

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

LIN YAOJIAN

Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSP

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

SHIM IL KWON

Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die

CHO NAMJU

Integrated circuit packaging system with stacking interconnect and method of manufacture thereof

PAGAILA REZA A

Semiconductor device and method of shielding semiconductor die from inter-device interference

BOE TECHNOLOGY GROUP CO LTD

Display substrate, display panel, and manufacturing method and driving method of display substrate

INTEL IP CORP

Systems and methods for signaling in an increased carrier monitoring wireless communication environment

MOHANTY SHANTIDEV

Techniques for traffic delivery to a group of devices

HE HONG

Automatic uplink-downlink ratio reconfiguration setting in wireless communication system