Inventor
BAYAN JAIME
US28 patents
⚠️ This page may combine multiple inventors who share the name “BAYAN JAIME”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAT SEMICONDUCTOR CORP
26 patentsUS6348726B1Feb 19, 2002
Multi row leadless leadframe package
NAT SEMICONDUCTOR CORP264 citations98
US7102209B1Sep 5, 2006
Substrate for use in semiconductor manufacturing and method of making same
NAT SEMICONDUCTOR CORP91 citations96
US6664615B1Dec 16, 2003
Method and apparatus for lead-frame based grid array IC packaging
NAT SEMICONDUCTOR CORP68 citations96
US6372539B1Apr 16, 2002
Leadless packaging process using a conductive substrate
NAT SEMICONDUCTOR CORP71 citations96
US6452255B1Sep 17, 2002
Low inductance leadless package
NAT SEMICONDUCTOR CORP103 citations95
US6399415B1Jun 4, 2002
Electrical isolation in panels of leadless IC packages
NAT SEMICONDUCTOR CORP145 citations95
US8679896B2Mar 25, 2014
DC/DC converter power module package incorporating a stacked controller and construction methodology
NAT SEMICONDUCTOR CORP23 citations92
US7608482B1Oct 27, 2009
Integrated circuit package with molded insulation
NAT SEMICONDUCTOR CORP33 citations92
US6916688B1Jul 12, 2005
Apparatus and method for a wafer level chip scale package heat sink
NAT SEMICONDUCTOR CORP25 citations92
US6674156B1Jan 6, 2004
Multiple row fine pitch leadless leadframe package with use of half-etch process
NAT SEMICONDUCTOR CORP39 citations92
US6617197B1Sep 9, 2003
Multi row leadless leadframe package
NAT SEMICONDUCTOR CORP19 citations92
US6448107B1Sep 10, 2002
Pin indicator for leadless leadframe packages
NAT SEMICONDUCTOR CORP39 citations91
US6686652B1Feb 3, 2004
Locking lead tips and die attach pad for a leadless package apparatus and method
NAT SEMICONDUCTOR CORP31 citations90
US7227245B1Jun 5, 2007
Die attach pad for use in semiconductor manufacturing and method of making same
NAT SEMICONDUCTOR CORP39 citations88
US7678617B1Mar 16, 2010
Universal laminator
NAT SEMICONDUCTOR CORP14 citations84
US7671452B1Mar 2, 2010
Microarray package with plated contact pedestals
NAT SEMICONDUCTOR CORP10 citations81
US6551048B1Apr 22, 2003
Off-load system for semiconductor devices
NAT SEMICONDUCTOR CORP11 citations73
US6677667B1Jan 13, 2004
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP11 citations72
US6576989B1Jun 10, 2003
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP10 citations72
US6963124B1Nov 8, 2005
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP0 citations51
US6933174B1Aug 23, 2005
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP0 citations51
US6818970B1Nov 16, 2004
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP0 citations51
US6808961B1Oct 26, 2004
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP1 citations51
US8375577B2Feb 19, 2013
Method of making foil based semiconductor package
NAT SEMICONDUCTOR CORP1 citations50
US7181835B2Feb 27, 2007
Universal clamping mechanism
NAT SEMICONDUCTOR CORP1 citations49
US6698088B2Mar 2, 2004
Universal clamping mechanism
NAT SEMICONDUCTOR CORP0 citations49