Inventor
SPALDING PETER H
US3 patents
Patents
3 patentsUS6686652B1Feb 3, 2004
Locking lead tips and die attach pad for a leadless package apparatus and method
NAT SEMICONDUCTOR CORP31 citations90
US5629563AMay 13, 1997
Component stacking in multi-chip semiconductor packages
NAT SEMICONDUCTOR CORP41 citations85
US5986332ANov 16, 1999
Integrated circuit leadframe incorporating overhanging leads
NAT SEMICONDUCTOR CORP0 citations39