Inventor
HU AH LEK
MY9 patents
Patents
9 patentsUS6872599B1Mar 29, 2005
Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
NAT SEMICONDUCTOR CORP94 citations97
US6452255B1Sep 17, 2002
Low inductance leadless package
NAT SEMICONDUCTOR CORP103 citations95
US6399415B1Jun 4, 2002
Electrical isolation in panels of leadless IC packages
NAT SEMICONDUCTOR CORP145 citations95
US7023074B2Apr 4, 2006
Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
NAT SEMICONDUCTOR CORP32 citations92
US6686652B1Feb 3, 2004
Locking lead tips and die attach pad for a leadless package apparatus and method
NAT SEMICONDUCTOR CORP31 citations90
US6629880B1Oct 7, 2003
Rotary mechanical buffing method for deflashing of molded integrated circuit packages
NAT SEMICONDUCTOR CORP14 citations81
US6467278B1Oct 22, 2002
Cooling for singulation of composite materials in molded semiconductor packages
NAT SEMICONDUCTOR CORP16 citations80
US7181835B2Feb 27, 2007
Universal clamping mechanism
NAT SEMICONDUCTOR CORP1 citations49
US6698088B2Mar 2, 2004
Universal clamping mechanism
NAT SEMICONDUCTOR CORP0 citations49