Inventor
NADARAJAH SANTHIRAN
MY14 patents
Patents
14 patentsUS6872599B1Mar 29, 2005
Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
NAT SEMICONDUCTOR CORP94 citations97
US6452255B1Sep 17, 2002
Low inductance leadless package
NAT SEMICONDUCTOR CORP103 citations95
US6399415B1Jun 4, 2002
Electrical isolation in panels of leadless IC packages
NAT SEMICONDUCTOR CORP145 citations95
US7023074B2Apr 4, 2006
Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
NAT SEMICONDUCTOR CORP32 citations92
US7002239B1Feb 21, 2006
Leadless leadframe packaging panel featuring peripheral dummy leads
NAT SEMICONDUCTOR CORP19 citations91
US6448107B1Sep 10, 2002
Pin indicator for leadless leadframe packages
NAT SEMICONDUCTOR CORP39 citations91
US6686652B1Feb 3, 2004
Locking lead tips and die attach pad for a leadless package apparatus and method
NAT SEMICONDUCTOR CORP31 citations90
US7227245B1Jun 5, 2007
Die attach pad for use in semiconductor manufacturing and method of making same
NAT SEMICONDUCTOR CORP39 citations88
US6677667B1Jan 13, 2004
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP11 citations72
US6576989B1Jun 10, 2003
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP10 citations72
US6963124B1Nov 8, 2005
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP0 citations51
US6933174B1Aug 23, 2005
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP0 citations51
US6818970B1Nov 16, 2004
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP0 citations51
US6808961B1Oct 26, 2004
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP1 citations51