Inventor
KANG AIK SENG
MY4 patents
Patents
4 patentsUS6452255B1Sep 17, 2002
Low inductance leadless package
NAT SEMICONDUCTOR CORP103 citations95
US6399415B1Jun 4, 2002
Electrical isolation in panels of leadless IC packages
NAT SEMICONDUCTOR CORP145 citations95
US6686652B1Feb 3, 2004
Locking lead tips and die attach pad for a leadless package apparatus and method
NAT SEMICONDUCTOR CORP31 citations90
US6629880B1Oct 7, 2003
Rotary mechanical buffing method for deflashing of molded integrated circuit packages
NAT SEMICONDUCTOR CORP14 citations81