Inventor
SIEGEL HARRY M
US18 patents
⚠️ This page may combine multiple inventors who share the name “SIEGEL HARRY M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SGS THOMSON MICROELECTRONICS
6 patentsUS5642265AJun 24, 1997
Ball grid array package with detachable module
SGS THOMSON MICROELECTRONICS44 citations96
US5557504ASep 17, 1996
Surface mountable integrated circuit package with detachable module
SGS THOMSON MICROELECTRONICS76 citations96
US5724728AMar 10, 1998
Method of mounting an integrated circuit to a mounting surface
SGS THOMSON MICROELECTRONICS29 citations92
US5451715ASep 19, 1995
Molded package integrated circuit with electrochemical cell
SGS THOMSON MICROELECTRONICS27 citations92
US5570273AOct 29, 1996
Surface mountable integrated circuit package with low-profile detachable module
SGS THOMSON MICROELECTRONICS47 citations91
US5610800AMar 11, 1997
Substrate mounting of circuit components with a low profile
SGS THOMSON MICROELECTRONICS18 citations84
SGS THOMSON MICROELECTRONICS INC
6 patentsUSD359028SJun 6, 1995
Socketed integrated circuit package
SGS THOMSON MICROELECTRONICS INC57 citations95
USD358806SMay 30, 1995
Socketed integrated circuit package
SGS THOMSON MICROELECTRONICS INC41 citations92
USD358805SMay 30, 1995
Detachable integrated circuit module
SGS THOMSON MICROELECTRONICS INC7 citations73
USD358804SMay 30, 1995
Detachable integrated circuit module
SGS THOMSON MICROELECTRONICS INC5 citations62
USD354275SJan 10, 1995
Low-profile detachable integrated circuit module
SGS THOMSON MICROELECTRONICS INC3 citations61
USD354274SJan 10, 1995
Low-profile detachable integrated circuit module
SGS THOMSON MICROELECTRONICS INC1 citations50
ST MICROELECTRONICS INC
5 patentsUS6693441B2Feb 17, 2004
Capacitive fingerprint sensor with protective coating containing a conductive suspension
ST MICROELECTRONICS INC36 citations92
US6762470B2Jul 13, 2004
Fingerprint sensor having a portion of the fluorocarbon polymer physical interface layer amorphized
ST MICROELECTRONICS INC21 citations91
US6700190B2Mar 2, 2004
Integrated circuit device with exposed upper and lower die surfaces
ST MICROELECTRONICS INC15 citations84
US6707093B2Mar 16, 2004
Selective ionic implantation of fluoropolymer film to modify the sensitivity of underlying sensing capacitors
ST MICROELECTRONICS INC6 citations72
US6759326B2Jul 6, 2004
Method of making a semiconductor device having a planarized fluoropolymer passivating layer with selectively implanted charged particles
ST MICROELECTRONICS INC4 citations61