Inventor
HSIEH TSUNG-TANG
TW4 patents
Patents
4 patentsUS6521300B1Feb 18, 2003
Method of a surface treatment in improving adhesion of an organic polymeric low-k dielectric layer
UNITED MICROELECTRONICS CORP19 citations81
US6827835B2Dec 7, 2004
Method for electroplated metal annealing process
UNITED MICROELECTRONICS CORP2 citations61
US6764965B2Jul 20, 2004
Method for improving the coating capability of low-k dielectric layer
UNITED MICROELECTRONICS CORP5 citations60
US6599826B2Jul 29, 2003
Method for fabricating a low dielectric constant material layer
UNITED MICROELECTRONICS CORP0 citations49