Inventor

SATOU YUTAKA

JP34 patents

⚠️ This page may combine multiple inventors who share the name “SATOU YUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SATOU YUTAKA

DAINIPPON INK & CHEMICALS

Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin

Curable composition and cured product thereof

Curable composition and cured product thereof

Active ester resin and composition and cured product using the same

Curable composition and cured product thereof

Active ester compound

Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring board

Epoxy compound, epoxy resin, curable compound, cured product thereof, semiconductor sealing material, and printed circuit board

Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded article

Active ester compound and composition and cured product obtained using the same

Epoxy resin, curable resin composition, cured product thereof, and printed circuit board

Epoxy compound, epoxy resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Active ester resin and cured product thereof

Active ester composition and cured product thereof

Phenolic-hydroxyl-containing resin, epoxy resin, curable resin composition, substance obtained by curing same, and semiconductor sealant

Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

SATOU YUTAKA

Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same

Epoxy compound, curable composition, and cured product thereof

Epoxy resin, curable resin composition and cured product thereof, and printed wiring board

Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit board

CALSONIC KANSEI CORP

Semiconductor component and power module

Electric compressor

Power module

FUJITSU LTD

Electronic apparatus

Electronic apparatus

HAYASHI KOJI

Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring board

Phosphorus-atom-containing oligomer composition, curable resin composition, cured product thereof, and printed circuit board

NISSAN MOTOR

Automobile

SEIKO INSTR INC

Semiconductor memory device

OGURA ICHIRO

Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin

VEHICLE ENERGY JAPAN INC

Prismatic secondary battery