Inventor

LIN CHIH-WEI

TW293 patents

⚠️ This page may combine multiple inventors who share the name “LIN CHIH-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN CHIH-WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Method of forming semiconductor packages having through package vias

Package on-package structure

Semiconductor package and manufacturing method thereof

3D package structure and methods of forming same

Package structure and method for forming the same

Aligning bumps in fan-out packaging process

Integrated fan-out packages with embedded heat dissipation structure

Semiconductor package, manufacturing method of semiconductor device and semiconductor package

Package structure

Package and manufacturing method thereof

Semiconductor package and method of fabricating the same

Package structures and methods for forming the same

Method of forming semiconductor packages having through package vias

Package structure and method for forming the same

Semiconductor package system and method

Alignment in the packaging of integrated circuits

Package structure and method for forming the same

Process for forming package-on-package structures

Semiconductor package system and method

RDL-first packaging process

Semiconductor structure with insertion layer and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG

Fan-out interconnect structure and method for forming same

Alignment in the packaging of integrated circuits

Packaging methods and packaged semiconductor devices

Packaged semiconductor devices and methods of packaging semiconductor devices

Process for forming package-on-package structures

Semiconductor structure and manufacturing method thereof

LU WEN-HSIUNG

Cu pillar bump with electrolytic metal sidewall protection

Forming wafer-level chip scale package structures with reduced number of seed layers

Conductive pillar for semiconductor substrate and method of manufacture

Package on package interconnect structure

Mechanisms for forming copper pillar bumps using patterned anodes

Mechanisms for forming copper pillar bumps using patterned anodes

LIN CHIH-WEI

Packaging methods and structures for semiconductor devices

Process for forming package-on-package structures

Method for fabricating bump structure without UBM undercut

ADVANCED CHIP ENG TECH INC

Wafer level package with good CTE performance

Structure of dielectric layers in built-up layers of wafer level package

AU OPTRONICS CORP

LED backlight module

UNITED MICROELECTRONICS CORP

Semiconductor device having void between gate electrode and sidewall spacer and manufacturing method thereof

CHENG MING-DA

Mechanisms for forming copper pillar bumps

LIM ZHENG-YI

Method of forming metal pillar

VANGUARD INT SEMICONDUCT CORP

High voltage semiconductor device and method for fabricating the same

QUANTA COMP INC

Two rack unit chassis and low profile tool-less hard drive carrier

CHEN MENG-TSE

Semiconductor packages having polymer-containing substrates and methods of forming same

YU CHEN-HUA

Package-on-package (PoP) structure having at least one package comprising one die being disposed in a core material between first and second surfaces of the core material

SINOX CO LTD

Lock

HU DYI-CHUNG

Chip packaging structure

Huang hui min

Packaging with interposer frame

HSIAO CHING-WEN

Package structures and methods for forming the same