Inventor

HUANG HUI-MIN

TW97 patents

⚠️ This page may combine multiple inventors who share the name “HUANG HUI-MIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG HUI-MIN

TAIWAN SEMICONDUCTOR MFG CO LTD

Package on-package structure

3D package structure and methods of forming same

Methods of packaging semiconductor devices and packaged semiconductor devices

Semiconductor package system and method

Methods of packaging and dicing semiconductor devices and structures thereof

Integrated fan-out structure and method

Semiconductor package system and method

Chip structure and method for forming the same

Semiconductor structure and method for forming the same

Package on-package structure

Methods of packaging semiconductor devices and packaged semiconductor devices

Packaged semiconductor devices and methods of packaging semiconductor devices

Methods of packaging semiconductor devices and packaged semiconductor devices

Wafer-level molding chase design

Wafer level chip scale package interconnects and methods of manufacture thereof

Molding structure for wafer level package

Package-on-package structure having polymer-based material for warpage control

Stacked dies with wire bonds and method

Interconnect structures for wafer level package and methods of forming same

Packages including multiple encapsulated substrate blocks and overlapping redistribution structures

3D package structure and methods of forming same

Method for forming a reconstructed package substrate comprising substrates blocks

3D package structure and methods of forming same

Method for forming a package structure

Semiconductor device structure with conductive bumps

Chip structure and method for forming the same

Semiconductor device structure with conductive bumps

Semiconductor package system and method

Semiconductor die including stress-resistant bonding structures and methods of forming the same

Package structure and method of forming the same

Package structure

Structure and formation method of semiconductor device with conductive bumps

Apparatus and method for forming a package structure

INNOLUX CORP

Display device

Display device

Display device

Display device

Display device

Display substrate and display device

Display device and display substrate

Display device

Display device

GM GLOBAL TECH OPERATIONS INC

Door assembly and method for a vehicle

IND TECH RES INST

Polymer thick film resistor pastes

CHEN MENG-TSE

Package-on-package structure having polymer-based material for warpage control

Huang hui min

Packaging with interposer frame

HUANG JUNG-PANG

Semiconductor package and fabrication method thereof

CHEN MENG TSE

Bump-on-trace packaging structure and method for forming the same

REALTEK SEMICONDUCTOR CORP

Receiving end of electronic device and method of setting phase threshold of timing recovery operation

TAIWAN SEMICONDUCTOR MFG

Packaged semiconductor devices and methods of packaging semiconductor devices