Inventor

ANG AI-TEE

TW23 patents

⚠️ This page may combine multiple inventors who share the name “ANG AI-TEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ANG AI-TEE

TAIWAN SEMICONDUCTOR MFG CO LTD

Package-on-package structure including a thermal isolation material and method of forming the same

Package on-package structure

Interconnect structure and method of fabricating same

Package on-package structure

Semiconductor processing boat design with pressure sensor

Systems for processing semiconductor devices, and methods of processing semiconductor devices

Semiconductor processing boat design with pressure sensor

Semiconductor processing boat design with pressure sensor

Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices

Package-on-package structure including a thermal isolation material

Package-on-package structure

System for processing semiconductor devices

Package-on-package structure

Manufacturing method of integrated fan-out package

Semiconductor processing boat design with pressure sensor

Package on-package structure including a thermal isolation material and method of forming the same

Integrated fan-out package and manufacturing method thereof

Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices

Package on-package joint structure with molding open bumps

TAIWAN SEMICONDUCTOR MFG

Reflow process and tool

Methods for metal bump die assembly

LIN CHENG-CHUNG

Fine-pitch package-on-package structures and methods for forming the same

CHEN MENG-TSE

Warpage control in a package-on-package structure