Inventor

CHENG MING-DA

TW408 patents

⚠️ This page may combine multiple inventors who share the name “CHENG MING-DA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHENG MING-DA

TAIWAN SEMICONDUCTOR MFG CO LTD

Method of forming semiconductor packages having through package vias

Package-on-package structure including a thermal isolation material and method of forming the same

Packages with molding structures and methods of forming the same

Package-on-package structure and method

Package on-package structure

3D package structure and methods of forming same

Methods of packaging semiconductor devices and packaged semiconductor devices

Packages with molding structures and methods of forming the same

Methods of forming connector pad structures, interconnect structures, and structures thereof

Dicing in wafer level package

Package structure and method for forming the same

Fan-out interconnect structure and methods forming the same

Package structure

Semiconductor packages having dummy connectors and methods of forming same

Package structures and methods for forming the same

Method of forming semiconductor packages having through package vias

Structure and formation method of chip package with fan-out structure

Semiconductor packages having dummy connectors and methods of forming same

Package structure and method for forming the same

Semiconductor package system and method

Alignment in the packaging of integrated circuits

Package structure and method for forming the same

Package on-package (PoP) structure including stud bulbs

Semiconductor packaging structure and method

Package on package structure and method for forming the same

Bonding structure for forming a package on package (PoP) structure and method for forming the same

Process for forming package-on-package structures

Methods of packaging and dicing semiconductor devices and structures thereof

Integrated fan-out structure and method

Semiconductor package system and method

Interconnect structure and method of fabricating same

Substrate and package structure

RDL-first packaging process

TAIWAN SEMICONDUCTOR MFG

System and method for an improved fine pitch joint

Interconnect structures and methods of forming same

Directly sawing wafers covered with liquid molding compound

Package on package bonding structure and method for forming the same

LU WEN-HSIUNG

Cu pillar bump with electrolytic metal sidewall protection

Forming wafer-level chip scale package structures with reduced number of seed layers

Conductive pillar for semiconductor substrate and method of manufacture

Package on package interconnect structure

LIN CHIH-WEI

Packaging methods and structures for semiconductor devices

Process for forming package-on-package structures

Method for fabricating bump structure without UBM undercut

YU CHEN-HUA

Package-on-package (PoP) structure including stud bulbs and method

Package on package devices and methods of packaging semiconductor dies

CHENG MING-DA

Mechanisms for forming copper pillar bumps

LIN HUNG-JEN

Package assembly and method of forming the same

LIM ZHENG-YI

Method of forming metal pillar

LIN CHUN-CHENG

Semiconductor packaging structure and method