Inventor
KIM BYUNG-MAN
KR15 patents
⚠️ This page may combine multiple inventors who share the name “KIM BYUNG-MAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
11 patentsUS6121118ASep 19, 2000
Chip separation device and method
SAMSUNG ELECTRONICS CO LTD149 citations98
US6103554AAug 15, 2000
Method for packaging integrated circuits with elastomer chip carriers
SAMSUNG ELECTRONICS CO LTD74 citations94
US6753599B2Jun 22, 2004
Semiconductor package and mounting structure on substrate thereof and stack structure thereof
SAMSUNG ELECTRONICS CO LTD48 citations92
US7521788B2Apr 21, 2009
Semiconductor module with conductive element between chip packages
SAMSUNG ELECTRONICS CO LTD8 citations83
US6421456B1Jul 16, 2002
Semiconductor wafer on which recognition marks are formed and method for sawing the wafer using the recognition marks
SAMSUNG ELECTRONICS CO LTD15 citations82
US6183589B1Feb 6, 2001
Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads
SAMSUNG ELECTRONICS CO LTD7 citations73
US7338568B2Mar 4, 2008
Method and arrangement for attaching labels to semiconductor modules
SAMSUNG ELECTRONICS CO LTD2 citations58
US7005735B2Feb 28, 2006
Array printed circuit board
SAMSUNG ELECTRONICS CO LTD3 citations58
US7061768B2Jun 13, 2006
Open socket
SAMSUNG ELECTRONICS CO LTD1 citations51
US7172106B2Feb 6, 2007
Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board
SAMSUNG ELECTRONICS CO LTD1 citations50
US10096756B2Oct 9, 2018
Side view light emitting diode package
SAMSUNG ELECTRONICS CO LTD0 citations40