Inventor
TU HUNG-JUNG
TW30 patents
⚠️ This page may combine multiple inventors who share the name “TU HUNG-JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
8 patentsUS8053277B2Nov 8, 2011
Three-dimensional integrated circuits with protection layers
TAIWAN SEMICONDUCTOR MFG27 citations93
US7955895B2Jun 7, 2011
Structure and method for stacked wafer fabrication
TAIWAN SEMICONDUCTOR MFG21 citations93
US7812459B2Oct 12, 2010
Three-dimensional integrated circuits with protection layers
TAIWAN SEMICONDUCTOR MFG21 citations93
US7466028B1Dec 16, 2008
Semiconductor contact structure
TAIWAN SEMICONDUCTOR MFG23 citations93
US9305769B2Apr 5, 2016
Thin wafer handling method
TAIWAN SEMICONDUCTOR MFG2 citations63
US7943421B2May 17, 2011
Component stacking using pre-formed adhesive films
TAIWAN SEMICONDUCTOR MFG3 citations62
US9093489B2Jul 28, 2015
Selective curing method of adhesive on substrate
TAIWAN SEMICONDUCTOR MFG0 citations52
US7354623B2Apr 8, 2008
Surface modification of a porous organic material through the use of a supercritical fluid
TAIWAN SEMICONDUCTOR MFG1 citations51
ADVANCED SEMICONDUCTOR ENG
6 patentsUS11127650B2Sep 21, 2021
Semiconductor device package including thermal dissipation element and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG8 citations83
US11631734B2Apr 18, 2023
Vertical capacitor structure having capacitor in cavity, and method for manufacturing the vertical capacitor structure
ADVANCED SEMICONDUCTOR ENG0 citations61
US11373956B2Jun 28, 2022
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations57
US11189604B2Nov 30, 2021
Device assembly structure and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations56
US10847602B2Nov 24, 2020
Vertical capacitor structure having capacitor in cavity and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations50
US11201110B2Dec 14, 2021
Semiconductor device package with conductive pillars and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations47
TAIWAN SEMICONDUCTOR MFG CO LTD
6 patentsUS10381254B2Aug 13, 2019
Wafer debonding and cleaning apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11264262B2Mar 1, 2022
Wafer debonding and cleaning apparatus
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10068789B2Sep 4, 2018
Method of using a wafer cassette to charge an electrostatic carrier
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9570331B2Feb 14, 2017
Wafer cassette with electrostatic carrier charging scheme
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9806062B2Oct 31, 2017
Methods of packaging semiconductor devices and packaged semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9406650B2Aug 2, 2016
Methods of packaging semiconductor devices and packaged semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51