Inventor

JAFFE MARK D

US139 patents

⚠️ This page may combine multiple inventors who share the name “JAFFE MARK D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JAFFE MARK D

IBM

Transistor structure with thick recessed source/drain structures and fabrication process of same

Backside device contact

Semiconductor structure with airgap

CMOS imager array with recessed dielectric

Bond pad for wafer and package for CMOS imager

Damascene copper wiring image sensor

Photodiode structures

Backside contact to final substrate

Pixel array, imaging sensor including the pixel array and digital camera including the imaging sensor

CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom

Image sensor including spatially different active and dark pixel interconnect patterns

Stacked imager package

Integrated circuit having pairs of parallel complementary FinFETs

Stacked imager package

CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom

Image sensor cells

Integrated circuit having pairs of parallel complementary FinFETs

Silicide strapping in imager transfer gate device

CMOS imager photodiode with enhanced capacitance

Recessed gate for an image sensor

Designing scan chains with specific parameter sensitivities to identify process defects

Trench isolation for active areas and first level conductors

Trench isolation for active areas and first level conductors

Photodiode structures

Photodiode structures

Photodiode structures

Switchable filters and design structures

Switchable filters and design structures

Semiconductor structure with airgap

Backside device contact

Switchable filters and design structures

Semiconductor structure with airgap

Switchable filters and design structures

Encapsulated sensors

Vertical bend waveguide coupler for photonics applications

Interface device with integrated solar cell(S) for power collection

High efficiency CMOS image sensor pixel employing dynamic voltage supply

ADKISSON JAMES W

Tunable filter structures and design structures

Self-dicing chips using through silicon vias

Method of manufacturing switchable filters

Method of manufacturing switching filters and design structures

Backside integration of RF filters for RF front end modules and design structure

Method of manufacturing switchable filters

Method of manufacturing a film bulk acoustic resonator with a loading element

Passivated through wafer vias in low-doped semiconductor substrates

CMOS imager photodiode with enhanced capacitance

GLOBALFOUNDRIES INC

Air gap over transistor gate and related method

Air gap over transistor gate and related method

ANDERSON BRENT A

Isolation structures for global shutter imager pixel, methods of manufacture and design structures

BERNSTEIN KERRY

Three dimensional vertical E-fuse structures and methods of manufacturing the same