Inventor
STAMPER ANTHONY K
US567 patents
⚠️ This page may combine multiple inventors who share the name “STAMPER ANTHONY K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
37 patentsUS10011477B2Jul 3, 2018
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM18 citations98
US9932225B2Apr 3, 2018
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM22 citations98
US9862598B2Jan 9, 2018
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM20 citations98
US9828243B2Nov 28, 2017
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM23 citations98
US9815690B2Nov 14, 2017
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM26 citations98
US9637373B2May 2, 2017
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM27 citations98
US9455187B1Sep 27, 2016
Backside device contact
IBM40 citations98
US9352954B2May 31, 2016
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM29 citations98
US9349793B2May 24, 2016
Semiconductor structure with airgap
IBM33 citations98
US9041128B2May 26, 2015
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM30 citations98
US7193289B2Mar 20, 2007
Damascene copper wiring image sensor
IBM89 citations98
US7188322B2Mar 6, 2007
Circuit layout methodology using a shape processing application
IBM192 citations98
US6433429B1Aug 13, 2002
Copper conductive line with redundant liner and method of making
IBM84 citations98
US6236103B1May 22, 2001
Integrated high-performance decoupling capacitor and heat sink
IBM93 citations98
US10315913B2Jun 11, 2019
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM13 citations96
US10308501B2Jun 4, 2019
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM13 citations96
US10246319B2Apr 2, 2019
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM12 citations96
US10214416B2Feb 26, 2019
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM13 citations96
US9926191B2Mar 27, 2018
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM12 citations96
US7405147B2Jul 29, 2008
Device and methodology for reducing effective dielectric constant in semiconductor devices
IBM35 citations96
US6680514B1Jan 20, 2004
Contact capping local interconnect
IBM48 citations96
US6498385B1Dec 24, 2002
Post-fuse blow corrosion prevention structure for copper fuses
IBM68 citations96
US6457234B1Oct 1, 2002
Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond
IBM53 citations96
US6452251B1Sep 17, 2002
Damascene metal capacitor
IBM61 citations96
US6436814B1Aug 20, 2002
Interconnection structure and method for fabricating same
IBM71 citations96
US6426249B1Jul 30, 2002
Buried metal dual damascene plate capacitor
IBM64 citations96
US6331481B1Dec 18, 2001
Damascene etchback for low ε dielectric
IBM75 citations96
US6310300B1Oct 30, 2001
Fluorine-free barrier layer between conductor and insulator for degradation prevention
IBM75 citations96
US6261895B1Jul 17, 2001
Polysilicon capacitor having large capacitance and low resistance and process for forming the capacitor
IBM47 citations96
US6214730B1Apr 10, 2001
Fluorine barrier layer between conductor and insulator for degradation prevention
IBM62 citations96
US6066577AMay 23, 2000
Method for providing fluorine barrier layer between conductor and insulator for degradation prevention
IBM76 citations96
US5930655AJul 27, 1999
Fluorine barrier layer between conductor and insulator for degradation prevention
IBM87 citations96
US10081540B2Sep 25, 2018
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM14 citations95
US6495917B1Dec 17, 2002
Method and structure of column interconnect
IBM71 citations95
US6362531B1Mar 26, 2002
Recessed bond pad
IBM39 citations95
US6677678B2Jan 13, 2004
Damascene structure using a sacrificial conductive layer
IBM110 citations94
US6566242B1May 20, 2003
Dual damascene copper interconnect to a damascene tungsten wiring level
IBM63 citations94
GLOBALFOUNDRIES INC
4 patentsUS10192779B1Jan 29, 2019
Bulk substrates with a self-aligned buried polycrystalline layer
GLOBALFOUNDRIES INC71 citations97
US10509244B1Dec 17, 2019
Optical switches and routers operated by phase-changing materials controlled by heaters
GLOBALFOUNDRIES INC23 citations94
US10461152B2Oct 29, 2019
Radio frequency switches with air gap structures
GLOBALFOUNDRIES INC15 citations94
US10211146B2Feb 19, 2019
Air gap over transistor gate and related method
GLOBALFOUNDRIES INC24 citations94
JAHNES CHRISTOPHER V
2 patentsHERRIN RUSSELL T
2 patentsDUNBAR III GEORGE A
2 patentsADKISSON JAMES W
1 patentDANG DINH
1 patentSTAMPER ANTHONY K
1 patentShowing the top 50 of 567 patents by PatentIndex Score.