Inventor

PARK YEONGIM

KR7 patents

⚠️ This page may combine multiple inventors who share the name “PARK YEONGIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

2 patents

US8357564B2Jan 22, 2013

Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die

STATS CHIPPAC LTD21 citations92

US9153476B2Oct 6, 2015

Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die

STATS CHIPPAC LTD5 citations83

CHI HEEJO

2 patents

US8587129B2Nov 19, 2013

Integrated circuit packaging system with through silicon via base and method of manufacture thereof

CHI HEEJO8 citations83

US8426955B2Apr 23, 2013

Integrated circuit packaging system with a stack package and method of manufacture thereof

CHI HEEJO0 citations51

CHOI DAESIK

1 patent

US9190297B2Nov 17, 2015

Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures

CHOI DAESIK14 citations83

LEE HYUNGMIN

1 patent

US8710668B2Apr 29, 2014

Integrated circuit packaging system with laser hole and method of manufacture thereof

LEE HYUNGMIN7 citations78

SHIN HANGIL

1 patent

US8723309B2May 13, 2014

Integrated circuit packaging system with through silicon via and method of manufacture thereof

SHIN HANGIL0 citations51