Inventor

PATLOLLA RAGHUVEER R

US38 patents

⚠️ This page may combine multiple inventors who share the name “PATLOLLA RAGHUVEER R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PATLOLLA RAGHUVEER R

IBM

Selective and non-selective barrier layer wet removal

Low-resistivity metallic interconnect structures with self-forming diffusion barrier layers

Selective surface modification of interconnect structures

Bottom electrode for MRAM applications

Selective and non-selective barrier layer wet removal

Selective and non-selective barrier layer wet removal

Rework and stripping of complex patterning layers using chemical mechanical polishing

Metal interconnects

Back end of line metallization structure

Back end of line metallization structure

Back end of line metallization structures

Back end of line integration for interconnects

Bottom electrode for MRAM applications

Low aspect ratio interconnect

Barrier planarization for interconnect metallization

Semiconductor interconnect structure with double conductors

Method and structure to reduce the electric field in semiconductor wiring interconnects

Forming dual metallization interconnect structures in single metallization level

Low oxygen cleaning for CMP equipment

Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability

Wet clean solutions to prevent pattern collapse

Semiconductor structures of more uniform thickness

Metal interconnects

Back end of line metallization structures

Cobalt contact and interconnect structures

Cobalt contact and interconnect structures

Forming dual metallization interconnect structures in single metallization level

Forming dual metallization interconnect structures in single metallization level

Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability

Selective surface modification of interconnect structures

Rework of patterned dielectric and metal hardmask films

Rework and stripping of complex patterning layers using chemical mechanical polishing

Surface conversion in chemical mechanical polishing

TESSERA INC

Semiconductor interconnect structure with double conductors

Low aspect ratio interconnect

GLOBALFOUNDRIES INC

Wafer bonding using boron and nitrogen based bonding stack

HUANG ELBERT EMIN

Method and structure to reduce the electric field in semiconductor wiring interconnects

TESSERA LLC

Semiconductor interconnect structure with double conductors