P

Inventor

MICHAEL MIHALIS

US10 patents
⚠️ This page may combine multiple inventors who share the name “MICHAEL MIHALIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VOLTERRA SEMICONDUCTOR CORP

4 patents
US9099340B2Aug 4, 2015

Power management applications of interconnect substrates

VOLTERRA SEMICONDUCTOR CORP12 citations91
US9520342B2Dec 13, 2016

Power management applications of interconnect substrates

VOLTERRA SEMICONDUCTOR CORP5 citations83
US10332827B2Jun 25, 2019

Power management application of interconnect substrates

VOLTERRA SEMICONDUCTOR CORP1 citations72
US10748845B2Aug 18, 2020

Power management application of interconnect substrates

VOLTERRA SEMICONDUCTOR CORP0 citations51

(unassigned)

2 patents
US6230400B1May 15, 2001

Method for forming interconnects

51 citations93
US6555759B2Apr 29, 2003

Interconnect structure

34 citations90

NVIDIA CORP

1 patent
US6778390B2Aug 17, 2004

High-performance heat sink for printed circuit boards

NVIDIA CORP124 citations96

TESSERA INC

1 patent
US6214640B1Apr 10, 2001

Method of manufacturing a plurality of semiconductor packages

TESSERA INC119 citations93

MICHAEL MIHALIS

1 patent
US9070662B2Jun 30, 2015

Chip-scale packaging with protective heat spreader

MICHAEL MIHALIS2 citations56

Volterra Semiconductor LLC

1 patent
US9806001B2Oct 31, 2017

Chip-scale packaging with protective heat spreader

Volterra Semiconductor LLC0 citations51