Inventor
TAN KWANG HONG
SG8 patents
⚠️ This page may combine multiple inventors who share the name “TAN KWANG HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VOLTERRA SEMICONDUCTOR CORP
4 patentsUS9099340B2Aug 4, 2015
Power management applications of interconnect substrates
VOLTERRA SEMICONDUCTOR CORP12 citations91
US9520342B2Dec 13, 2016
Power management applications of interconnect substrates
VOLTERRA SEMICONDUCTOR CORP5 citations83
US10332827B2Jun 25, 2019
Power management application of interconnect substrates
VOLTERRA SEMICONDUCTOR CORP1 citations72
US10748845B2Aug 18, 2020
Power management application of interconnect substrates
VOLTERRA SEMICONDUCTOR CORP0 citations51
MICRON TECHNOLOGY INC
3 patentsUS6720666B2Apr 13, 2004
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC91 citations95
US6692987B2Feb 17, 2004
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC60 citations94
US7112048B2Sep 26, 2006
BOC BGA package for die with I-shaped bond pad layout
MICRON TECHNOLOGY INC4 citations60