Inventor

SONG JIK-HO

KR2 patents

⚠️ This page may combine multiple inventors who share the name “SONG JIK-HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

1 patent

US9502341B2Nov 22, 2016

Printed circuit board and semiconductor package using the same

SAMSUNG ELECTRONICS CO LTD4 citations70

SONG JIK-HO

1 patent

US9030021B2May 12, 2015

Printed circuit board having hexagonally aligned bump pads for substrate of semiconductor package, and semiconductor package including the same

SONG JIK-HO3 citations47