Inventor

SEANGATITH JIRAPORN

US3 patents

⚠️ This page may combine multiple inventors who share the name “SEANGATITH JIRAPORN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

2 patents

US9659899B2May 23, 2017

Die warpage control for thin die assembly

INTEL CORP2 citations70

US12581968B2Mar 17, 2026

Package architecture of large dies using quasi-monolithic chip layers

INTEL CORP0 citations60

SANE SANDEEP B

1 patent

US9123732B2Sep 1, 2015

Die warpage control for thin die assembly

SANE SANDEEP B1 citations43