Inventor
RIMBERT-RIVIERE CHARLES
DE8 patents
Patents
8 patentsUS10074590B1Sep 11, 2018
Molded package with chip carrier comprising brazed electrically conductive layers
INFINEON TECHNOLOGIES AG16 citations89
US11217467B2Jan 4, 2022
Transport system
INFINEON TECHNOLOGIES AG1 citations49
US10283432B2May 7, 2019
Molded package with chip carrier comprising brazed electrically conductive layers
INFINEON TECHNOLOGIES AG0 citations49
US12571727B2Mar 10, 2026
Apparatus comprising infrared cameras and a temperature source and method for detecting cracks in samples by infrared radiation
INFINEON TECHNOLOGIES AG0 citations47
US12431395B2Sep 30, 2025
Semiconductor power module with crack sensing
INFINEON TECHNOLOGIES AG0 citations40
US12390887B2Aug 19, 2025
Method for separating substrates
INFINEON TECHNOLOGIES AG0 citations40
US12205826B2Jan 21, 2025
Method for forming a semiconductor substrate arrangement
INFINEON TECHNOLOGIES AG0 citations39
US10141199B2Nov 27, 2018
Selecting a substrate to be soldered to a carrier
INFINEON TECHNOLOGIES AG1 citations39