Inventor

KAMINENI VIMAL

US31 patents

⚠️ This page may combine multiple inventors who share the name “KAMINENI VIMAL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KAMINENI VIMAL

GLOBALFOUNDRIES INC

Self-aligned contact with CMP stop layer

Method of enhancing surface doping concentration of source/drain regions

Low line resistivity and repeatable metal recess using CVD cobalt reflow

Methods for fabricating integrated circuits with improved contact structures

Semiconductor devices and methods of fabrication with reduced gate and contact resistances

Semiconductor device having a metal gate recess

Self-aligned contact etch for fabricating a FinFET

Devices and methods of cobalt fill metallization

Integrated circuits with improved contact structures

Method for forming a semiconductor device having a metal gate recess

Methods, apparatus, and system for protecting cobalt formations from oxidation during semiconductor device formation

Contacting source and drain of a transistor device

Gate pickup method using metal selectivity

Methods, apparatus, and system for protecting cobalt formations from oxidation during semiconductor device formation

Method, apparatus, and system for MOL interconnects without titanium liner

Method, apparatus, and system for MOL interconnects without titanium liner

Method to protect MOL metallization from hardmask strip process

Methods of forming contact structures for semiconductor devices and the resulting devices

PSIQUANTUM CORP

Superconducting nanowire single photon detector and method of fabrication thereof

Superconducting nanowire single photon detector and method of fabrication thereof

Isolation of waveguide-integrated detectors using a back end of line process

Method and structure to incorporate multiple low loss photonic circuit components

Superconducting nanowire single photon detector and method of fabrication thereof

Structure and method to remove semiconductor chip material for optical signal access to a photonic chip

Low loss optical interposer

IBM

Local interconnect structure including non-eroded contact via trenches

Interlayer dielectric replacement techniques with protection for source/drain contacts

Local interconnect structure including non-eroded contact via trenches

Contact interlayer dielectric replacement with improved SAC cap retention

Robust gate cap for protecting a gate from downstream metallization etch operations

GLOBALFOUNDRIES US INC

Methods of forming air gaps between source/drain contacts and the resulting devices