P

Inventor

KIM JAE HAK

KR39 patents
⚠️ This page may combine multiple inventors who share the name “KIM JAE HAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

21 patents
US9353984B2May 31, 2016

Refrigerator having double doors

SAMSUNG ELECTRONICS CO LTD56 citations97
US7183195B2Feb 27, 2007

Method of fabricating dual damascene interconnections of microelectronic device using hybrid low k-dielectric and carbon-free inorganic filler

SAMSUNG ELECTRONICS CO LTD24 citations92
US6861347B2Mar 1, 2005

Method for forming metal wiring layer of semiconductor device

SAMSUNG ELECTRONICS CO LTD31 citations92
US6828229B2Dec 7, 2004

Method of manufacturing interconnection line in semiconductor device

SAMSUNG ELECTRONICS CO LTD33 citations92
US6432843B1Aug 13, 2002

Methods of manufacturing integrated circuit devices in which a spin on glass insulation layer is dissolved so as to recess the spin on glass insulation layer from the upper surface of a pattern

SAMSUNG ELECTRONICS CO LTD26 citations92
US6855629B2Feb 15, 2005

Method for forming a dual damascene wiring pattern in a semiconductor device

SAMSUNG ELECTRONICS CO LTD12 citations84
US6815331B2Nov 9, 2004

Method for forming metal wiring layer of semiconductor device

SAMSUNG ELECTRONICS CO LTD20 citations84
US6849536B2Feb 1, 2005

Inter-metal dielectric patterns and method of forming the same

SAMSUNG ELECTRONICS CO LTD12 citations82
US7064059B2Jun 20, 2006

Method of forming dual damascene metal interconnection employing sacrificial metal oxide layer

SAMSUNG ELECTRONICS CO LTD12 citations81
US7488687B2Feb 10, 2009

Methods of forming electrical interconnect structures using polymer residues to increase etching selectivity through dielectric layers

SAMSUNG ELECTRONICS CO LTD7 citations73
US7022600B2Apr 4, 2006

Method of forming dual damascene interconnection using low-k dielectric material

SAMSUNG ELECTRONICS CO LTD10 citations72
US7323407B2Jan 29, 2008

Method of fabricating dual damascene interconnections of microelectronic device using diffusion barrier layer against base material

SAMSUNG ELECTRONICS CO LTD8 citations68
US7541276B2Jun 2, 2009

Methods for forming dual damascene wiring for semiconductor devices using protective via capping layer

SAMSUNG ELECTRONICS CO LTD6 citations63
US7041592B2May 9, 2006

Method for forming a metal interconnection layer of a semiconductor device using a modified dual damascene process

SAMSUNG ELECTRONICS CO LTD2 citations63
US6936533B2Aug 30, 2005

Method of fabricating semiconductor devices having low dielectric interlayer insulation layer

SAMSUNG ELECTRONICS CO LTD6 citations63
US7635645B2Dec 22, 2009

Method for forming interconnection line in semiconductor device and interconnection line structure

SAMSUNG ELECTRONICS CO LTD6 citations62
US7192864B2Mar 20, 2007

Method of forming interconnection lines for semiconductor device

SAMSUNG ELECTRONICS CO LTD5 citations62
US7687381B2Mar 30, 2010

Method of forming electrical interconnects within insulating layers that form consecutive sidewalls including forming a reaction layer on the inner sidewall

SAMSUNG ELECTRONICS CO LTD4 citations60
US7737029B2Jun 15, 2010

Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby

SAMSUNG ELECTRONICS CO LTD0 citations52
US7690557B2Apr 6, 2010

System and method for displaying received data using separate device

SAMSUNG ELECTRONICS CO LTD0 citations52
US7307014B2Dec 11, 2007

Method of forming a via contact structure using a dual damascene process

SAMSUNG ELECTRONICS CO LTD0 citations41

KOREA RES INST CHEM TECH

3 patents

HYUNDAI MOTOR CO LTD

2 patents

GENERAL NANO LLC

2 patents

DAEWOO ELECTRONICS CO LTD

1 patent

KOREA RES INST CHEMICAL TECH

1 patent

LG CHEMICAL LTD

1 patent

KOREAN AIR LINES CO LTD

1 patent

DONG WHA PHARM IND CO LTD

1 patent

ST PHARM CO LTD

1 patent

POSTECH RES & BUSINESS DEV FOUND

1 patent

UNIV TEXAS

1 patent

KIM JAE HAK

1 patent

LG DISPLAY CO LTD

1 patent

CHOI JUN-YOUNG

1 patent