Inventor
KODA MASASHI
JP11 patents
Patents
11 patentsUS11866536B2Jan 9, 2024
Copper-clad laminate plate, resin-attached copper foil, and circuit board using same
PANASONIC IP MAN CO LTD2 citations71
US11958951B2Apr 16, 2024
Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board
PANASONIC IP MAN CO LTD0 citations60
US11242425B2Feb 8, 2022
Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate
PANASONIC IP MAN CO LTD0 citations60
US12581593B2Mar 17, 2026
Prepreg, and metal-clad laminated board and wiring substrate obtained using same
PANASONIC IP MAN CO LTD0 citations50
US12233621B2Feb 25, 2025
Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil
PANASONIC IP MAN CO LTD0 citations50
US12024590B2Jul 2, 2024
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
PANASONIC IP MAN CO LTD0 citations50
US12022611B2Jun 25, 2024
Prepreg, metal-clad laminate, and wiring board
PANASONIC IP MAN CO LTD0 citations50
US11820105B2Nov 21, 2023
Prepreg, metal-clad laminate, and wiring board
PANASONIC IP MAN CO LTD0 citations50
US11401393B2Aug 2, 2022
Prepreg, metal-clad laminate, and wiring board
PANASONIC IP MAN CO LTD0 citations50
US12428534B2Sep 30, 2025
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminated board, and wiring board
PANASONIC IP MAN CO LTD0 citations46
US12312452B2May 27, 2025
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
PANASONIC IP MAN CO LTD0 citations46