Inventor
HOSHINO YASUNORI
JP12 patents
Patents
12 patentsUS11866536B2Jan 9, 2024
Copper-clad laminate plate, resin-attached copper foil, and circuit board using same
PANASONIC IP MAN CO LTD2 citations71
US11958951B2Apr 16, 2024
Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring board
PANASONIC IP MAN CO LTD0 citations60
US11242425B2Feb 8, 2022
Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate
PANASONIC IP MAN CO LTD0 citations60
US12021015B2Jun 25, 2024
Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substrate
PANASONIC IP MAN CO LTD0 citations56
US12581593B2Mar 17, 2026
Prepreg, and metal-clad laminated board and wiring substrate obtained using same
PANASONIC IP MAN CO LTD0 citations50
US12233621B2Feb 25, 2025
Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil
PANASONIC IP MAN CO LTD0 citations50
US12024590B2Jul 2, 2024
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
PANASONIC IP MAN CO LTD0 citations50
US12022611B2Jun 25, 2024
Prepreg, metal-clad laminate, and wiring board
PANASONIC IP MAN CO LTD0 citations50
US11820105B2Nov 21, 2023
Prepreg, metal-clad laminate, and wiring board
PANASONIC IP MAN CO LTD0 citations50
US11401393B2Aug 2, 2022
Prepreg, metal-clad laminate, and wiring board
PANASONIC IP MAN CO LTD0 citations50
US11647583B2May 9, 2023
Prepreg, metal-clad laminated board, and printed wiring board
PANASONIC IP MAN CO LTD0 citations41
US10472478B2Nov 12, 2019
Prepreg, metal-clad laminate and printed wiring board
PANASONIC IP MAN CO LTD0 citations35