Inventor
Foo Loke Yip
MY10 patents
⚠️ This page may combine multiple inventors who share the name “Foo Loke Yip”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
6 patentsUS11393758B2Jul 19, 2022
Power delivery for embedded interconnect bridge devices and methods
INTEL CORP3 citations72
US12237245B2Feb 25, 2025
Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same
INTEL CORP0 citations61
US11107751B2Aug 31, 2021
Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same
INTEL CORP0 citations61
US11805602B2Oct 31, 2023
Chip assemblies
INTEL CORP0 citations60
US11527481B2Dec 13, 2022
Stacked semiconductor package with flyover bridge
INTEL CORP0 citations50
US11562959B2Jan 24, 2023
Embedded dual-sided interconnect bridges for integrated-circuit packages
INTEL CORP0 citations49
ALTERA CORP
4 patentsUS7081772B1Jul 25, 2006
Optimizing logic in non-reprogrammable logic devices
ALTERA CORP7 citations70
US9978735B2May 22, 2018
Interconnection of an embedded die
ALTERA CORP3 citations68
US12125768B2Oct 22, 2024
Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same
ALTERA CORP0 citations61
US9842181B1Dec 12, 2017
Method to optimize general-purpose input/output interface pad assignments for integrated circuit
ALTERA CORP0 citations41