Inventor
LEE WAI LING
MY12 patents
⚠️ This page may combine multiple inventors who share the name “LEE WAI LING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
7 patentsUS10903142B2Jan 26, 2021
Micro through-silicon via for transistor density scaling
INTEL CORP8 citations83
US11652026B2May 16, 2023
Micro through-silicon via for transistor density scaling
INTEL CORP2 citations72
US11398415B2Jul 26, 2022
Stacked through-silicon vias for multi-device packages
INTEL CORP3 citations72
US11393758B2Jul 19, 2022
Power delivery for embedded interconnect bridge devices and methods
INTEL CORP3 citations72
US12112997B2Oct 8, 2024
Micro through-silicon via for transistor density scaling
INTEL CORP0 citations62
US12080628B2Sep 3, 2024
Micro through-silicon via for transistor density scaling
INTEL CORP0 citations62
US11393741B2Jul 19, 2022
Micro through-silicon via for transistor density scaling
INTEL CORP0 citations62
IBM
3 patentsUS6442634B2Aug 27, 2002
System and method for interrupt command queuing and ordering
IBM59 citations95
US6065088AMay 16, 2000
System and method for interrupt command queuing and ordering
IBM63 citations95
US6279064B1Aug 21, 2001
System and method for loading commands to a bus, directly loading selective commands while queuing and strictly ordering other commands
IBM22 citations92