Inventor
HSIEH WEI-KANG
TW10 patents
Patents
10 patentsUS11682626B2Jun 20, 2023
Chamfered die of semiconductor package and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11515268B2Nov 29, 2022
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US11004827B2May 11, 2021
Semiconductor package and manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12125804B2Oct 22, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11854986B2Dec 26, 2023
Chamfered die of semiconductor package and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11824017B2Nov 21, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12166015B2Dec 10, 2024
Semiconductor package and manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11646296B2May 9, 2023
Semiconductor package and manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12406941B2Sep 2, 2025
Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12374592B2Jul 29, 2025
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50