Inventor
QI QUAN
US13 patents
⚠️ This page may combine multiple inventors who share the name “QI QUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
3 patentsUS6858466B1Feb 22, 2005
System and a method for fluid filling wafer level packages
HEWLETT PACKARD DEVELOPMENT CO20 citations89
US7436571B2Oct 14, 2008
Micro-displays
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US7465600B2Dec 16, 2008
Package for a micro-electro mechanical device
HEWLETT PACKARD DEVELOPMENT CO0 citations45
INTEL IP CORP
3 patentsUS10049961B1Aug 14, 2018
Partially molded direct chip attach package structures for connectivity module solutions
INTEL IP CORP13 citations82
US10332821B2Jun 25, 2019
Partially molded direct chip attach package structures for connectivity module solutions
INTEL IP CORP2 citations71
US10103088B1Oct 16, 2018
Integrated antenna for direct chip attach connectivity module package structures
INTEL IP CORP3 citations67
HUAWEI TECH CO LTD
3 patentsUS7962593B2Jun 14, 2011
System and method for publishing advertisement service information
HUAWEI TECH CO LTD3 citations62
US8839276B2Sep 16, 2014
Open application programming interface selection method and device
HUAWEI TECH CO LTD0 citations45
US10783171B2Sep 22, 2020
Address search method and device
HUAWEI TECH CO LTD0 citations35