Inventor

KUO HOU-CHANG

TW4 patents

⚠️ This page may combine multiple inventors who share the name “KUO HOU-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSIEH CHIN-TANG

2 patents

US8497571B2Jul 30, 2013

Thin flip chip package structure

HSIEH CHIN-TANG2 citations56

US8471372B2Jun 25, 2013

Thin flip chip package structure

HSIEH CHIN-TANG0 citations45

ADVANCED SEMICONDUCTOR ENG

1 patent

US6483187B1Nov 19, 2002

Heat-spread substrate

ADVANCED SEMICONDUCTOR ENG61 citations93

CHIPBOND TECHNOLOGY CORP

1 patent

US12550764B2Feb 10, 2026

Layout structure of flexible circuit board

CHIPBOND TECHNOLOGY CORP0 citations40