Inventor
HSIEH YI-LING
TW5 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH YI-LING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPBOND TECHNOLOGY CORP
3 patentsUS11503698B1Nov 15, 2022
Flexible circuit board and heat spreader thereof
CHIPBOND TECHNOLOGY CORP0 citations57
US12550764B2Feb 10, 2026
Layout structure of flexible circuit board
CHIPBOND TECHNOLOGY CORP0 citations40
US12564056B2Feb 24, 2026
Inner lead structure of flexible circuit board
CHIPBOND TECHNOLOGY CORP0 citations39