Inventor

JUSKEY FRANK J

US30 patents

⚠️ This page may combine multiple inventors who share the name “JUSKEY FRANK J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JUSKEY FRANK J

MOTOROLA INC

Leadless integrated circuit package

Light erasable multichip module

Thermally conductive integrated circuit package with radio frequency shielding

Method of forming a three-dimensional printed circuit assembly

Integrated circuit package having a face-to-face IC chip arrangement

Anchoring method for flow formed integrated circuit covers

Flip-chip package for integrated circuits

Encapsulated electronic package

Method of making a transfer molded semiconductor device

Transfer molded semiconductor device package with integral shield

Method of selectively releasing plastic molding material from a surface

Moisture relief for chip carrier

Multicomponent integrated circuit package

Transfer molded semiconductor package with improved adhesion

Non-hardening solvent removable hydrophobic conformal coatings

Molded ring integrated circuit package

Transfer molding compound

Grounding an ultra high density pad array chip carrier

Transmission line using fluroplastic as a dielectric

Process for fabricating flex circuits and product thereby

Circuit components having different characteristics with constant size

Subliming solder flux composition

AMKOR TECHNOLOGY INC

Printed circuit board with integral heat sink for semiconductor package

Making semiconductor packages with stacked dies and reinforced wire bonds

Low-cost printed circuit board with integral heat sink for semiconductor package

JUSKEY FRANK J

Sheet-molded chip-scale package

Wafer level package with embedded passive components and method of manufacturing

ADVANCED INTERCONNECT TECH LTD

Thin multiple semiconductor die package

Lead frame with included passive devices

TRIQUINT SEMICONDUCTOR INC

Ultrathin flip-chip packaging techniques and configurations