Inventor
BANERJI KINGSHUK
US15 patents
Patents
15 patentsUS5535101AJul 9, 1996
Leadless integrated circuit package
MOTOROLA INC351 citations99
US5311059AMay 10, 1994
Backplane grounding for flip-chip integrated circuit
MOTOROLA INC198 citations98
US5293067AMar 8, 1994
Integrated circuit chip carrier
MOTOROLA INC142 citations97
US5446625AAug 29, 1995
Chip carrier having copper pattern plated with gold on one surface and devoid of gold on another surface
MOTOROLA INC74 citations96
US5203076AApr 20, 1993
Vacuum infiltration of underfill material for flip-chip devices
MOTOROLA INC170 citations96
US5166774ANov 24, 1992
Selectively releasing conductive runner and substrate assembly having non-planar areas
MOTOROLA INC84 citations96
US5573602ANov 12, 1996
Solder paste
MOTOROLA INC51 citations95
US5427865AJun 27, 1995
Multiple alloy solder preform
MOTOROLA INC52 citations95
US5540379AJul 30, 1996
Soldering process
MOTOROLA INC37 citations92
US5415944AMay 16, 1995
Solder clad substrate
MOTOROLA INC29 citations92
US5152451AOct 6, 1992
Controlled solder oxidation process
MOTOROLA INC34 citations92
US5499756AMar 19, 1996
Method of applying a tacking agent to a printed circuit board
MOTOROLA INC20 citations91
US5429293AJul 4, 1995
Soldering process
MOTOROLA INC35 citations91
US5262674ANov 16, 1993
Chip carrier for an integrated circuit assembly
MOTOROLA INC22 citations90
US5623127AApr 22, 1997
Single alloy solder clad substrate
MOTOROLA INC10 citations73