Inventor

CHAN BENSON

US52 patents

⚠️ This page may combine multiple inventors who share the name “CHAN BENSON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHAN BENSON

IBM

Printed circuit board to module mounting and interconnecting structure and method

Compliant, surface-mountable interposer

Fiber optic connections and method for using same

Optical device with chip level precision alignment

Assembly of opto-electronic module with improved heat sink

Printed wiring board interposer sub-assembly and method

Printed wiring board interposer sub-assembly

Method and apparatus for locating electrical circuit members

Multi-functional fiber optic coupler

Electronic chip packaging

Surface mount socket

Computer system with surface mount socket

Method and system for testing an electronic module mounted on a printed circuit board

Land grid array connector and method for forming the same

Module mounting assembly

Assembly of opto-electronic module with improved heat sink

Alignment systems for subassemblies of overmolded optoelectronic modules

Electronic package assembly and connector for use therewith

Electronic package assembly and connector for use therewith

Electrical coupling of substrates by conductive buttons

Method of making an interposer sub-assembly in a printed wiring board

Optical fiber guide module and a method for making the same

Non-oriented wire in elastomer electrical contact

Single C-beam contact

Enhanced optical transceiver arrangement

Non-oriented wire in elastomer electrical contact

Optical coupler replication arrangement and process

Enhanced optical coupler

Non-oriented wire in elastomer electrical contact

ENDICOTT INTERCONNECT TECH INC

High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same

High speed circuit board and method for fabrication

LED lighting assembly and lamp utilizing same

Circuitized substrate with internal cooling structure and electrical assembly utilizing same

Method of making circuitized substrate with internal optical pathway

Interposer and test assembly for testing electronic devices

Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same

Electronic card assembly

Radio frequency device for tracking goods

Method of making circuitized substrate with internal optical pathway using photolithography

Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same

Method of making high speed circuit board

Human being tracking and monitoring system

High density connector for interconnecting fine pitch circuit packaging structures

Method and system for tracking goods

Spring actuated clamping mechanism

CHAN BENSON

Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same

Sampling sufficiency testing

UNIV NEW YORK STATE RES FOUND

Bidirectional AC-DC converter with multilevel power factor correction

DAS RABINDRA N

Electrically conductive adhesive (ECA) for multilayer device interconnects

JDS UNIPHASE CORP

Processing protective plug insert for optical modules